A two-component epoxy putty, component A, which is a thixotropic mixture of epoxy resins, active thinners, fillers, pigments and targeted additives. Component B is a polyamine hardener containing a filler and special additives. After curing, it has high strength characteristics, high adhesion to most building materials: concrete, natural and artificial stone, brick, steel, PVC, TPO. Elimination of defects with a depth of 1 to 15 mm.
Advantages · It does not require separate primer compositions; ·Designed specifically for the preparation of the surface of the building structure for the installation of an external reinforcement system based on carbon composite materials; ·High adhesion to various surfaces: concrete, metal, wood, brick; ·Thixotropy (when applied to vertical surfaces and horizontal overlaps, it does not slide or peel off) when applying a layer of 15 mm; ·High wear resistance; ·High strength in early hardening periods.
Application domain ·Prompt repair of edges, chips, restoration of linear geometric dimensions of structures in short time intervals; ·Leveling and finishing of the surfaces of building structures before the installation of the external reinforcement system; · Repair of small defects and surface leveling: filling pores, caverns, chips, potholes, erosion; · Repair of cracks; ·Installation of carbon bars (composite reinforcement)
Preparation of the materialMix ratio A:B = 2:1 (by weight). Use a mixer with a mixing attachment (no more than 400 revolutions per minute), paying special attention to mixing the material at the bottom and sides. Mix each of the components separately. Add component B to the bucket with component A, then mix for 3 minutes at a lower speed (in order to to reduce air involvement) until the formulation reaches a homogeneous consistency and becomes a uniform black color. The flow rate is ~2 kg/m2 per 1 mm of thickness.
Requirements for the foundationBefore applying Xwrap Resin Putty, the concrete substrate must be machined to remove cement milk, loose and adhering particles, sags, contaminants and old coatings. The treated substrate must be dedusted. The presence of water on the surface is not allowed, the required humidity is not more than 4%.
Application of the material Work on the application of the material should be carried out at the ambient and base temperatures from +10 °C to +35 °C and relative humidity of no more than 90%. The prepared Xwrap Resin Putty compound is applied to the substrate with a trowel or flat trowel, taking into account the required thickness of application when leveling the substrate or the depth of defects when eliminating defects on the concrete surface of the structure. The range of application thickness of Xwrap Resin Putty varies from 1 to 15 mm. If a layer of more than 15 mm is applied, the repair compound is applied in two layers to prevent the material from creeping. The second layer is applied immediately after the curing of the first layer of the repair compound. Storage ·Shelf life is 24 months from the date of manufacture. ·Epoxy putty is stored in unbroken factory packaging in warehouses at a temperature not lower than +5°C and not higher than +30°C.